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Packaging Engineering
for FACILITY SUPPORT SERVICES  

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SME  Material & Packaging Re-Design for EEE Device Protection 

 RMV Leadership for Innovative           Packaging Designs                        

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IOPP Ameristar Award Winner for the USA No. 1 Electronic Packaging Design
Bob  Vermillion, CPP/Fellow
 

The types of testing that we conduct:

 

1.    First Article Outer Packaging Qualification for EEE parts

2.   Validation of Packaging System for Storage and Transport

3.   Verification of Supplier Raw Material for Packaging Design

4.   Qualification Testing: ANSI/ESD, NASA 8739 STD, Section 7, MIL.STDs.

5.   Field Testing for Harsh Environments

6.   Packaging Redesign to lower Cost 

7.   CNT, ICP, IDP and Other Engineered Materials for Research & 

       Development of a New or Mature Packaging Scheme

8.  Material/Product/Packaging for ESD compliance in low RH and extreme environments not to be substituted for ESDA TR-53 verification that is neither  traceable to ANSI/ESDA Standards nor intended for ESD compliance in low RH and extreme conditions as required by Space & Defense. ​

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To visit our facility at NASA Ames Research Park,  please contact

RMV Technology Group LLC         Hispanic High Tech SDVOSB

      a  NASA Alliance Partner

NASA Ames Research Park

Space Portal Building 555

P O Box 7

Moffett Field, CA 94035-0007

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CALL

T     1-650-964-4792

F     1-650-964-1268 

               

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© 2025. RMV Technology Group LLC. All rights reserved.
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